Heat-dissipating module for digital light processing projector

ABSTRACT

A heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface is contacted with a digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface to the first surface. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm through the thermal conduction structure and the penetrating part, the heat is transferred from the plural fins to the plural fins and then dissipated to surroundings through the plural fins.

FIELD OF THE INVENTION

The present invention relates to a heat-dissipating module, and moreparticularly to a heat-dissipating module for a digital micromirrordevice of a digital light processing projector.

BACKGROUND OF THE INVENTION

With rapid development of digitalized techniques, projectors becomeessential image display devices in business centers, homes, exhibitionhalls or other places. Generally, the projectors are classified into twotypes, i.e. a liquid crystal display (LCD) projector and a digital lightprocessing (DLP) projector. Since the DLP projector has high contrast,rapid response speed and high reliability, the DLP projector becomes apredominant product of the contemporary display devices. Generally, thecore element of a DLP projector comprises a main board and a digitalmicromirror device (DMD). The main board comprises a plurality ofdigital video signal processors. The digital micromirror devicecomprises a micromirror set. The micromirror set of the digitalmicromirror device is a principal display unit of the DLP projector.

During the projecting operation of the DLP projector is performed, sincethe light beam is collected on the digital micromirror device, a greatdeal of heat is generated. It is important to take a heat-dissipatingmeasure to effectively remove the heat.

Generally, the heat-dissipating module for the digital micromirrordevice at least comprises a thermal conduction structure. The thermalconduction structure is attached on the surface of the digitalmicromirror device. After the heat from the digital micromirror deviceis transferred to the thermal conduction structure, the heat is furtherdissipated away to the surroundings through heat pipes (not shown), fins(not shown) or a cold plate (not shown).

FIG. 1A schematically illustrates a conventional thermal conductionstructure of a heat-dissipating module applied to a digital micromirrordevice. As shown in FIG. 1A, the thermal conduction structure 1comprises a base 10 and a connecting part 11. The base 10 and theconnecting part 11 are integrally formed into a single-piece structure.Both of the base 10 and the connecting part 11 are made of aluminum forexample. The connecting part 11 has a surface 11 a. The surface 11 a iscontacted with the digital micromirror device. Consequently, the heatmay be transferred from the digital micromirror device to the thermalconduction structure 1. The base 10 of the thermal conduction structure1 also has a surface 10 a. The surface 10 a of the base 10 is opposed tothe surface 11 a of the connecting part 11. Moreover, heat pipes (notshown) are contacted with or embedded into the surface 10 a of the base10. Consequently, the heat may be transferred from the thermalconduction structure 1 to the heat pipes and further dissipated to thesurroundings. From the above discussions, the heat generated by thedigital micromirror device may be transferred to the heat pipes throughthe thermal conduction structure 1 and then dissipated to thesurroundings. However, the heat-dissipating efficiency of the thermalconduction structure 1 is restricted by the material and thermalconductivity thereof.

FIG. 1B schematically illustrates another conventional thermalconduction structure of a heat-dissipating module applied to a digitalmicromirror device. As shown in FIG. 1B, the thermal conductionstructure 1 comprises a base 10 and a connecting part 11. The connectingpart 11 has a surface 11 a. The base 10 of the thermal conductionstructure 1 also has a surface 10 a. The surface 10 a of the base 10 isopposed to the surface 11 a of the connecting part 11. The surface 11 aof the connecting part 11 is contacted with the digital micromirrordevice. Consequently, the heat may be transferred from the digitalmicromirror device to the thermal conduction structure 1. In the thermalconduction structure 1 of FIG. 1B, the base 10 and the connecting part11 are made of different materials. For example, the base 10 is made ofaluminum, and the connecting part 11 is made of copper. Similarly, theheat-dissipating efficiency of the thermal conduction structure 1 isrestricted by the material and thermal conductivity thereof.

FIG. 1C schematically illustrates another conventional thermalconduction structure of a heat-dissipating module applied to a digitalmicromirror device. The base 10 is divided into a first portion 10 c anda second portion 10 b. The first portion 10 c of the base 10 and theconnecting part 11 are made of the same material (e.g. copper).Moreover, the first portion 10 c and the connecting part 11 may beintegrally formed into a single-piece structure. The second portion 10 bof the base 10 is made of aluminum. Similarly, the heat-dissipatingefficiency of the thermal conduction structure 1 is restricted by thematerial and thermal conductivity thereof.

In the above-mentioned heat-dissipating module, the heat generated bythe digital micromirror device is transferred to the heat pipes throughthe thermal conduction structure 1. The thermal conductivity of thethermal conduction structure 1 as shown in FIGS. 1A˜1C is ranged from200 to 400. Namely, the heat-dissipating efficiency of the thermalconduction structure 1 is restricted by the material and thermalconductivity thereof. Since the thermal resistance of the thermalconduction structure fails to be further reduced, the overallheat-dissipating efficacy of the heat-dissipating module is unsatisfied.

SUMMARY OF THE INVENTION

The present invention provides a heat-dissipating module for a digitalmicromirror device of a digital light processing projector. Theinventive heat-dissipating module comprises a thermal conductionstructure and a heat pipe, wherein a penetrating part of the heat piperuns through a connecting part of the thermal conduction structure sothat the penetrating part of the heat pipe can be directly contactedwith the digital micromirror device. Therefore, the heat-dissipatingefficiency along the vertical direction is increased, the thermalspreading resistance is largely reduced, and the overallheat-dissipating efficiency of the heat-dissipating module is enhanced.

In accordance with an aspect of the present invention, there is provideda heat-dissipating module for a digital light processing projector. Thedigital light processing projector includes a digital micromirrordevice. The heat-dissipating module includes a thermal conductionstructure, at least one heat pipe, and plural fins. The thermalconduction structure includes a connecting part. The connecting part hasa first surface and a second surface opposed to the first surface. Thefirst surface of the connecting part is contacted with the digitalmicromirror device. The heat pipe includes a penetrating part and asuspension arm. The suspension arm is connected with the penetratingpart. The penetrating part runs through the connecting part of thethermal conduction structure from the second surface of the connectingpart to the first surface of the connecting part. The penetrating partis contacted with the digital micromirror device. The plural fins arecontacted with the suspension arm. After the heat generated by thedigital micromirror device is transferred to the suspension arm of theheat pipe through the thermal conduction structure and the penetratingpart of the heat pipe, the heat is transferred from the suspension armto the plural fins and then dissipated to surroundings through theplural fins.

The above contents of the present invention will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A schematically illustrates a conventional thermal conductionstructure of a heat-dissipating module applied to a digital micromirrordevice;

FIG. 1B schematically illustrates another conventional thermalconduction structure of a heat-dissipating module applied to a digitalmicromirror device;

FIG. 1C schematically illustrates another conventional thermalconduction structure of a heat-dissipating module applied to a digitalmicromirror device;

FIG. 2A is a schematic perspective view illustrating a front side of aheat-dissipating module for a digital light processing projectoraccording to a first embodiment of the present invention;

FIG. 2B is a schematic perspective view illustrating a rear side of theheat-dissipating module of FIG. 2A;

FIG. 2C is a schematic cross-sectional view illustrating theheat-dissipating module of FIG. 2A;

FIG. 2D is a schematic assembled view illustrating the heat-dissipatingmodule of FIG. 2B;

FIG. 3 is a schematic cross-sectional view illustrating aheat-dissipating module for a digital light processing projectoraccording to a second embodiment of the present invention;

FIG. 4 is a schematic perspective view illustrating the rear side of aheat-dissipating module for a digital light processing projectoraccording to a third embodiment of the present invention; and

FIG. 5 is a schematic cross-sectional view illustrating aheat-dissipating module for a digital light processing projectoraccording to a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

FIG. 2A is a schematic perspective view illustrating a front side of aheat-dissipating module for a digital light processing projectoraccording to a first embodiment of the present invention. FIG. 2B is aschematic perspective view illustrating a rear side of theheat-dissipating module of FIG. 2A. As shown in FIGS. 2A and 2B, theheat-dissipating module 2 comprises a thermal conduction structure 20,at least one heat pipe 22, and plural fins 23. The thermal conductionstructure 20 comprises a connecting part 21. The connecting part 21 hasa first surface 21 a and a second surface 21 b. The first surface 21 aand the second surface 21 b are opposed to each other. The first surface21 a of the connecting part 21 is contacted with a digital micromirrordevice (DMD) 3 of a digital light processing (DLP) projector (notshown).

In this embodiment, the at least one heat pipe 22 comprises two heatpipes 22 a and 22 b. The number of the heat pipes is not restricted.That is, the number of the heat pipes may be varied according to thepractical requirements. Moreover, the heat pipe 22 a comprises apenetrating part 221 a and a suspension arm 225 a, and the heat pipe 22b comprises a penetrating part 221 b and a suspension arm 225 b. Thesuspension arms 225 a and 225 b are connected with the penetrating parts221 a and 221 b, respectively. Consequently, the heat may be transferredto the suspension arms 225 a and 225 b through the penetrating parts 221a and 221 b. Moreover, the suspension arms 225 a and 225 b are contactedwith the plural fins 23. Consequently, the heat may further transferredfrom the suspension arms 225 a and 225 b to the surroundings through theplural fins 23.

The two penetrating parts 221 a and 221 b run through the connectingpart 21 downwardly from the second surface 21 b of the connecting part21 to the first surface 21 a of the connecting part 21. Moreover, inthis embodiment, the penetrating part 221 a has a terminal surface 220a, and the penetrating part 221 b has a terminal surface 220 b. Afterthe two penetrating parts 221 a and 221 b run through the connectingpart 21 vertically, the terminal surfaces 220 a and 220 b are coplanarwith the first surface 21 a of the connecting part 21. Consequently, thepenetrating parts 221 a and 221 b may be directly contacted with thedigital micromirror device 3 through the terminal surfaces 220 a and 220b. Moreover, since the heat pipes 22 a and 22 b are made of thematerials with high thermal conductivity, the heat can be quicklytransferred to the plural fins 23 through the heat pipes 22 a and 22 b,and then dissipated to the surroundings.

In this embodiment, the suspension arm 225 a of the heat pipe 22 acomprises a first extension segment 222 a, a bent segment 223 a, and asecond extension segment 224 a. Similarly, the suspension arm 225 b ofthe heat pipe 22 b comprises a first extension segment 222 b, a bentsegment 223 b, and a second extension segment 224 b. The first extensionsegment 222 a is connected with the penetrating part 221 a, so that theheat from the penetrating part 221 a may be transferred to the firstextension segment 222 a. Similarly, the first extension segment 222 b isconnected with the penetrating part 221 b, so that the heat from thepenetrating part 221 b may be transferred to the first extension segment222 b. A first end of the bent segment 223 a is connected with the firstextension segment 222 a, and a second end of the bent segment 223 a isconnected with the second extension segment 224 a. Consequently, theheat from the first extension segment 222 a may be further transferredto the second extension segment 224 a through the bent segment 223 a.Similarly, a first end of the bent segment 223 b is connected with thefirst extension segment 222 b, and a second end of the bent segment 223b is connected with the second extension segment 224 b. Consequently,the heat from the first extension segment 222 b may be furthertransferred to the second extension segment 224 b through the bentsegment 223 b. Moreover, the first extension segments 222 a, 222 b andthe second extension segments 224 a, 224 b run through the plural fins23. Consequently, when the cooling liquid (not shown) within the heatpipes 22 a and 22 b flow through the heat pipes 22 a and 22 b, the heatmay be further transferred from the first extension segments 222 a, 222b and the second extension segments 224 a, 224 b of the heat pipes 22 aand 22 b to the plural fins 23. Moreover, due to the large surface ofthe plural fins 23, the heat exchange between the plural fins 23 and theambient air is enhanced. In such way, the heat-dissipating efficacy isenhanced.

Please refer to FIGS. 2A and 2B again. In this embodiment, the firstextension segment 222 a is substantially parallel with the secondextension segment 224 a, and the first extension segment 222 b issubstantially parallel with the second extension segment 224 b. Thefirst extension segment 222 a of the heat pipe 22 a and the firstextension segment 222 b of the heat pipe 22 b are extended in oppositedirections. Consequently, the two bent segments 223 a and 223 b arelocated at two opposite sides of the connecting part 21 of the thermalconduction structure 20, and the two second extension segments 224 a and224 b are located at other two opposite sides of the connecting part 21of the thermal conduction structure 20. That is, the connecting part 21of the thermal conduction structure 20 is enclosed by the bent segments223 a, 223 b and the second extension segments 224 a, 224 b of thesuspension arms 225 a, 225 b of the heat pipes 22 a and 22 b. Since theconnecting part 21 of the thermal conduction structure 20 is enclosed bythe heat pipes 22 a and 22 b, the two parallel first extension segments222 a and 222 b run through the plural fins 23 in a staggered form, andthe two parallel second extension segments 224 a and 224 b run throughthe plural fins 23 in a staggered form. Due to the above configurations,the overall volume of the heat-dissipating module 2 is reduced, and thelayout area of the heat-dissipating module 2 on the DLP projector isdecreased. Under this circumstance, the applications of theheat-dissipating module 2 are expanded.

FIG. 2C is a schematic cross-sectional view illustrating theheat-dissipating module of FIG. 2A. FIG. 2D is a schematic assembledview illustrating the heat-dissipating module of FIG. 2B. Please referto FIGS. 2A˜2D. The digital micromirror device 3 comprises a digitalmicromirror chip 30 and a micromirror set 31. The micromirror set 31 isdisposed on the digital micromirror chip 30. A surface 30 a of thedigital micromirror chip 30 is contacted with the connecting part 21 ofthe thermal conduction structure 20 (see FIG. 2C). Consequently, theheart generated by the digital micromirror chip 30 can be transferred tothe heat-dissipating module 2 through the connecting part 21. Inaddition, the two penetrating parts 221 a and 221 b of the heat pipes 22a and 22 b run through the connecting part 21 of the thermal conductionstructure 20 vertically (see FIGS. 2C and 2D). After the two penetratingparts 221 a and 221 b run through the connecting part 21 from the secondsurface 21 b to the first surface 21 a of the connecting part 21, theterminal surfaces 220 a and 220 b are coplanar with the first surface 21a of the connecting part 21. After the heat-dissipating module 2 iscontacted with the digital micromirror device 3, the penetrating parts221 a and 221 b may be directly contacted with the digital micromirrordevice 3 through the terminal surfaces 220 a and 220 b. Consequently,the heat may be directly transferred to the penetrating parts 221 a and221 b through the terminal surfaces 220 a and 220 b. Moreover, when thecooling liquid (not shown) within the heat pipes 22 a and 22 b flowthrough the heat pipes 22 a and 22 b, the heat may be transferred to theplural fins 23 through the first extension segments 222 a, 222 b, thebent parts 223 a, 223 b and the second extension segments 224 a, 224 bsequentially. Then, the heat is transferred from the plural fins 23 tothe surroundings.

Since the at least one heat pipe 22 runs through the connecting part 21to be contacted with the digital micromirror chip 30, the heat can bedirectly and efficiently transferred from the digital micromirror chip30 to the at least one heat pipe 22. In addition, the heat is alsotransferred to the surroundings through the thermal conduction structure20. Consequently, the heat-dissipating efficiency along the verticaldirection of the at least one heat pipe is enhanced, the thermalspreading resistance is largely reduced, and the overallheat-dissipating efficiency of the heat-dissipating module is enhanced.When compared with the conventional heat-dissipating module oftransferring the heat to the heat pipe through the thermal conductionstructure, the heat-dissipating module of the present invention candirectly transfer the heat to the fins through the heat pipe.

Please refer to FIG. 2C again. In some embodiments, an adhesive (notshown) is arranged between the connecting part 21 of the thermalconduction structure 20 and the digital micromirror chip 30 of thedigital micromirror device 3. An example of the adhesive includes but isnot limited to an insulated and thermally-conductive adhesive. Theadhesive is used for facilitating connection between the connecting part21 and the digital micromirror chip 30 while achieving the insulatingand thermally-conducting purposes. In some embodiments, the connectingpart 21 of the thermal conduction structure 20 is made of aluminum inorder to reduce the cost and weight of the thermal conduction structure20. In some other embodiments, the digital light processing (DLP)projector further comprises an active heat-dissipating mechanism (notshown). An example of the active heat-dissipating mechanism includes butis not limited to a fan. By using the active heat-dissipating mechanismto remove the heat from the plural fins 23, the overall heat-dissipatingefficiency of the heat-dissipating module 2 is further enhanced.

FIG. 3 is a schematic cross-sectional view illustrating aheat-dissipating module for a digital light processing projectoraccording to a second embodiment of the present invention. As shown inFIG. 3, the heat-dissipating module 4 comprises a thermal conductionstructure 40, at least one heat pipe 43 and plural fins 44. The thermalconduction structure 40 comprises a connecting part 41. The connectingpart 41 has a first surface 41 a and a second surface 41 b, wherein thefirst surface 41 a and the second surface 41 b are opposed to eachother. The first surface 41 a of the connecting part 41 is contactedwith a digital micromirror device (DMD) 5 of a digital light processing(DLP) projector (not shown).

In this embodiment, the at least one heat pipe 43 also comprises apenetrating part 431 and a suspension arm 432. In addition, thesuspension arm 432 also comprises a first extension segment 433, a bentsegment 434, and a second extension segment 435. The configurations ofthe connecting part 41 of the thermal conduction structure 40, the heatpipe 43 and the plural fins 44 are similar to those of the aboveembodiments, and are not redundantly described herein.

In this embodiment, the thermal conduction structure 40 furthercomprises a base 42. The base 42 is a flat plate, but is not limited tothe flat plate. The base 42 has a third surface 42 a and a fourthsurface 42 b, wherein the third surface 42 a and the fourth surface 42 bare opposed to each other. The third surface 42 a of the base 42 isconnected with the second surface 41 b of the connecting part 41. Inaddition, the area of the third surface 42 a of the base 42 is greaterthan the area of the second surface 41 b of the connecting part 41 inorder to increase the structural strength of the thermal conductionstructure 40 and the base 42. In this embodiment, the penetrating part431 of the heat pipe 43 runs through the base 42 vertically from thefourth surface 42 b of the base 42 to the first surface 42 a of the base42, and then runs through the connecting part 41 from the second surface41 b of the connecting part 41 to the first surface 41 a of theconnecting part 41. In such way, the terminal surface 431 a of thepenetrating part 431 is directly contacted with the digital micromirrordevice 5. Consequently, the heat is directly transferred to the heatpipe 43. Since the heat pipe 43 is made of the material with highthermal conductivity, the heat can be quickly transferred to the pluralfins 44 through the heat pipe 43, and then dissipated to thesurroundings. In other words, the heat-dissipating efficiency along thevertical direction of the heat pipe 43 is enhanced, the thermalspreading resistance is largely reduced, and the overallheat-dissipating efficiency of the heat-dissipating module 4 isenhanced.

FIG. 4 is a schematic perspective view illustrating the rear side of aheat-dissipating module for a digital light processing projectoraccording to a third embodiment of the present invention. Like the aboveembodiment, the heat-dissipating module 4 comprises a thermal conductionstructure 40, at least one heat pipe 43 and plural fins 44. Therelationships between the connecting part 41, the first surface 41 a,the heat pipe 43, the penetrating part 431, the terminal surface 431 aand the plural fins 44 are similar to the above embodiment, and are notredundantly described herein.

In this embodiment, the thermal conduction structure 40 furthercomprises a base 42. The base 42 comprises a flat plate 420 and a frame421. The flat plate 420 is enclosed by the frame 421. In addition, twoedges of the flat plate 420 are connected to inner surfaces of the frame421. The arrangement of the frame 421 may increase the structuralstrength of the flat plate 420 and support the plural fins 44. Moreover,as shown in FIG. 4, the frame 421 further comprises positioningstructures 422 (e.g. through-holes). By penetrating screws through thepositioning structures 422 and tightening the screws in the casing (notshown) of the digital light processing (DLP) projector, the frame 421 ofthe base 42 are fixed on the casing. In such way, the structuralstrength of the heat-dissipating module 4 and the base 42 is enhanced,and the heat-dissipating module 4 is securely fixed on the digital lightprocessing (DLP) projector.

FIG. 5 is a schematic cross-sectional view illustrating aheat-dissipating module for a digital light processing projectoraccording to a fourth embodiment of the present invention. As shown inFIG. 5, the heat-dissipating module 6 comprises a thermal conductionstructure 60, at least one heat pipe 63 and plural fins 64. Theconfigurations of the connecting part 61 of the thermal conductionstructure 60, the heat pipe 63 and the plural fins 64 are similar tothose of the above embodiments, and are not redundantly describedherein.

In this embodiment, the thermal conduction structure 60 furthercomprises a base 62. The base 62 is a flat plate with pluralheat-dissipating slices 62 c. The base 62 has a third surface 62 a and afourth surface 62 b, wherein the third surface 62 a and the fourthsurface 62 b are opposed to each other. The third surface 62 a of thebase 62 is connected with the second surface 61 b of the connecting part61. The plural heat-dissipating slices 62 c are extended from the fourthsurface 62 b of the base 62 for facilitating the thermal conductionstructure 60 to dissipate the heat. Similarly, the penetrating part 631of the heat pipe 63 runs through the connecting part 61 vertically fromthe second surface 61 b of the connecting part 61 to the first surface61 a of the connecting part 61. In such way, the terminal surface 631 aof the penetrating part 631 is directly contacted with the digitalmicromirror chip 70 of the digital micromirror device 7. Consequently,the heat can be directly and efficiently transferred from the digitalmicromirror chip 70 to the at least one heat pipe 63. Since the heat isfurther transferred to the surroundings through the thermal conductionstructure 60, the heat-dissipating efficiency along the verticaldirection of the at least one heat pipe 62 is enhanced, and the thermalspreading resistance is largely reduced. Moreover, due to the largeareas of the plural fins 64 and the plural heat-dissipating slices 62 c,the efficacy of the heat exchange between the heat-dissipating module 6and the ambient air is increased. Consequently, the overallheat-dissipating efficiency of the heat-dissipating module 6 isenhanced.

From the above descriptions, the present invention provides aheat-dissipating module for a digital light processing projector. Theheat-dissipating module comprises a thermal conduction structure, atleast one heat pipe, and plural fins. The thermal conduction structurecomprises a connecting part. A penetrating part of the heat pipe runsthrough the connecting part of the thermal conduction structure from asecond surface of the connecting part to a first surface of theconnecting part. Consequently, the terminal surface of the penetratingpart is coplanar with the first surface of the connecting part, anddirectly contacted with the digital micromirror device of the digitallight processing projector. Since the heat pipe is made of the materialwith high thermal conductivity, the heat can be quickly transferred tothe large-area fins through the suspension arm of the heat pipe, andthen dissipated to the surroundings. In such way, the heat-dissipatingefficiency along the vertical direction is increased, the thermalspreading resistance is largely reduced, and the overallheat-dissipating efficiency of the heat-dissipating module is enhanced.When compared with the conventional heat-dissipating module oftransferring the heat to the heat pipe through the thermal conductionstructure, the heat-dissipating module of the present invention candirectly transfer the heat to the fins through the heat pipe.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. A heat-dissipating module for a digital lightprocessing projector, said digital light processing projector comprisinga digital micromirror device, said heat-dissipating module comprising: athermal conduction structure comprising a connecting part, wherein saidconnecting part has a first surface and a second surface opposed to saidfirst surface, wherein said first surface is contacted with said digitalmicromirror device; at least one heat pipe comprising a penetrating partand a suspension arm, wherein said suspension arm is connected with saidpenetrating part, wherein said penetrating part runs through saidconnecting part of said thermal conduction structure from said secondsurface to said first surface, and said penetrating part is contactedwith said digital micromirror device; and a plurality of fins contactedwith said suspension arm, wherein after the heat generated by saiddigital micromirror device is transferred to said suspension arm of saidheat pipe through said thermal conduction structure and said penetratingpart of said heat pipe, the heat is transferred from said suspension armto said plural fins and then dissipated to surroundings through saidplural fins.
 2. The heat-dissipating module according to claim 1,wherein said penetrating part of said heat pipe has a terminal surface,wherein said terminal surface of said penetrating part is coplanar withsaid first surface of said connecting part, and said terminal surface ofsaid penetrating part is contacted with said digital micromirror device.3. The heat-dissipating module according to claim 1, wherein saiddigital micromirror device comprises a digital micromirror chip, whereinsaid first surface of said connecting part and said penetrating part ofsaid heat pipe are contacted with said digital micromirror chip.
 4. Theheat-dissipating module according to claim 1, wherein said suspensionarm of said heat pipe comprises a first extension segment, a bentsegment and a second extension segment, wherein said first extensionsegment is connected with said penetrating part, said bent segment isconnected with said first extension segment and said second extensionsegment, and said first extension segment and said second extensionsegment are contacted with said plural fins.
 5. The heat-dissipatingmodule according to claim 4, wherein said first extension segment andsaid second extension segment are parallel with each other.
 6. Theheat-dissipating module according to claim 1, wherein said thermalconduction structure further comprises a base, wherein said base isconnected with said connecting part, and said base has a third surfaceand a fourth surface opposed to said third surface, wherein said thirdsurface of said base is connected with said second surface of saidconnecting part.
 7. The heat-dissipating module according to claim 6,wherein after said penetrating part runs through said base from saidfourth surface to said third surface, said penetrating part runs throughsaid connecting part of said thermal conduction structure from saidsecond surface to said first surface, and said penetrating part iscontacted with said digital micromirror device.
 8. The heat-dissipatingmodule according to claim 6, wherein said base further comprises pluralheat-dissipating slices, which are extended from said fourth surface ofsaid base.
 9. The heat-dissipating module according to claim 6, whereinsaid base further a frame for supporting said plural fins, and saidframe has plural positioning structures for facilitating positioningsaid heat-dissipating module.
 10. The heat-dissipating module accordingto claim 1, wherein said connecting part of said thermal conductionstructure and said digital micromirror device are connected with eachother through an adhesive, wherein said adhesive is an insulated andthermally-conductive adhesive.